According to a new report from Intel Market Research, the global ABF (Ajinomoto Build-up Film) Substrate market was valued at USD 4,890 million in 2024 and is projected to reach USD 9,548 million by 2032, exhibiting a robust CAGR of 10.6% during the forecast period (2025–2032). This growth is driven by increasing demand for advanced semiconductor packaging, rising adoption in...